Manufacturing method a flash memory cell array

ABSTRACT

A flash memory cell array comprises a substrate, a string of memory cell structures and source region/drain region. Each of memory cell structures includes a stack gate structure including a select gate dielectric layer, a select gate and a gate cap layer formed on the substrate; a spacer is set on the sidewall of the select gate; a control gate connected to the stack gate structure is set on the one side of the stack gate structure; a floating gate is set between the control gate and the substrate; an inter-gate dielectric layer is set between the control gate and the floating gate; and a tunneling dielectric layer is set between the floating gate and the substrate. The source region/drain region is set in the substrate near outer control gate and stack gate structure of the flash memory cell array.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of a prior application Ser. No.10/604,819, filed Aug. 19, 2003 now U.S. Pat. No. 6,911,690.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to a semiconductor device, and moreparticularly to a flash memory cell array and manufacturing methodthereof.

2. Background of the Related Art

Flash memory is a non-volatile solid state memory that maintains dataeven after all power sources have been disconnected. Flash memory hasbeen widely used in personal computers and other electronic equipmentbecause of its programmable features allowing writing, erasing andreading data a number of times.

A conventional flash memory cell is a transistor comprising a controlgate, a doped polysilicon floating gate and an oxide layer separatingthese two gates from each other. A tunnel oxide layer separates thefloating gate and the substrate. Because the floating gate is insulatedby oxide, any negative charge on a floating gate does not leak, even ifthe power is off.

To write/erase the data in the cell, a bias voltage is applied to thedrain in order to push electrons into the floating gate or pullelectrons out of the floating gate by Fowler-Nordhem tunneling. To readthe data in the cell, a working voltage is applied to the control gateto determine whether the channel is on or off. The value of the data(“0” or “1”) depends on the amounts of electrons trapped in the floatinggate, which affect the status of the channel.

During data erase operation, however, it is very difficult to controlthe amount of the electrons flowing out of the floating gate and maymake the floating gate positively charged due to over-pulling thetrapped electrons. This effect is so call “over-erase”. If theover-erase effect is too severe, the channel will be always on, evenwithout applying the working voltage to the control gate. It causes tomis-read the value in the cell.

To prevent the over-erase effect, some flash memory devices have usedsplit gate design. It has an additional “select gate” on the side wallof the control gate and the floating gate and uses an oxide layerseparating the select gate from the control gate, the floating gate, andthe substrate. Hence, even if the over-erase effect occurred, thechannel below the erase gate would still be off to avoid mis-reading thedata. However, the size of the split-gate flash memory cell becomeslarger than that of conventional flash memory cell because it requires alarger area for the split gate structure. This would cause the concernin high integration density issue.

One may use NAND gate array, instead of NOR gate array, for split gateflash memory in order to increase its integration density because NANDgate array allows serial connection of the memory cells. However, thewrite/read operations are much more complicated for NAND gate array.Furthermore, the current is smaller due to the serial connection, whichseriously affects the performance of the memory cells because of alonger write/erase cycles.

SUMMARY OF THE INVENTION

An object of the invention is to provide a flash memory cell, a flashmemory cell array and manufacturing method thereof to manufacture flashmemory cells suitable for NAND gate array structure by using source-sideinjection (“SSI”) to enhance the programming speed and efficiency of thecells.

It is another object of the invention to provide a flash memory cell, aflash memory cell array and manufacturing method thereof to increase thearea between the control gate and the floating gate thereby increasingthe gate's coupling rate to enhance the cell's performance.

The present invention provides a flash memory cell, which comprises asubstrate, a stack gate structure formed on the substrate. The stackgate structure includes a select gate dielectric layer, a select gate,and a gate cap layer. The select gate dielectric layer is formed betweenthe substrate and the select gate. The gate cap layer is formed on theselect gate. A spacer formed is along the sidewall of the select gate, acontrol gate is connected to the stack gate structure, wherein thecontrol gate is formed on the one side of the stack gate structure. Afloating gate formed between the control gate and the substrate. Thefloating gate includes a recess, a inter-gate dielectric layer formedbetween the control gate and the floating gate. A tunneling dielectriclayer is formed between the floating gate and the substrate. A drainregion and a source region are formed in the substrate, wherein thedrain region and the source region are formed on the one side and theother side of the control gate and the stack gate structurerespectively.

In the present invention, the floating gate includes a recess. Thisincreases the contact surface area between the control gate and thefloating gate to raise the gate coupling rate of flash memory cells andto reduce the working voltage, thereby enhancing flash memory cells'operation speed and efficiency.

The present invention also provide a flash memory cell array, whichcomprises a substrate, a plurality of flash memory cell structures onthe substrate, and a drain region and a source region are formed in thesubstrate, wherein the drain region and the source region are formed onthe one side and the other side of the control gates and the stack gatestructures respectively. Each of the flash memory cell structuresincludes a stack gate structure formed on the substrate. The stack gatestructure includes a select gate dielectric layer, a select gate and agate cap layer wherein the select gate dielectric layer is formedbetween the substrate and the select gate and the gate cap layer isformed on the select gate. A spacer is formed along the sidewall of theselect gate. A control gate is connected to the stack gate structure.The control gate is formed on one side of the stack gate structure. Afloating gate is formed between the control gate and the substrate andincludes a recess. An inter-gate dielectric layer is formed between thecontrol gate and the floating gate, wherein the control gate, theinter-gate dielectric layer, and the floating gate, constitutes a stackstructure. A tunneling dielectric layer is formed between the floatinggate and the substrate. The stack gate structure of the plurality offlash memory cell structures are positioned juxtaposing alternativelywith the stack structure.

Because there is no gap between each flash memory cell structure, andtherefore a highly integrated flash memory cell array can be realized.Furthermore, the floating gate includes a recess. This increases thecontact surface area between the control gate and the floating gate toraise the gate coupling rate of flash memory cells and to reduce theworking voltage, thereby enhancing flash memory cells' operation speedand efficiency.

This present invention also provides a method for fabricating a flashmemory cell array. A substrate having a device insulating structure isprovided. A plurality of stack gate structures are formed on thesubstrate. The stack gate structure includes a select gate dielectriclayer, a select gate, and a cap layer, the select gate dielectric layerformed between the substrate and the select gate, the cap layer formedon the select gate. A tunnel dielectric layer is formed on thesubstrate. A spacer is formed along the sidewall of the select gate. Afloating gate is formed between each of the stack gate structures,wherein the floating gate includes a recess, and an top surface of thefloating gate connected to the stack gate structure is between a topsurface of the cap layer and a top surface of the select gate. Next, aninter-gate dielectric layer is formed on the floating gate. Next, acontrol gate is formed to fill the gap between each of the stack gatestructures. Then the plurality of stack gate structures are removed toisolate a predetermined area of the flash memory cell array. Next, adrain region and a source region are formed in the substrate, whereinthe drain region and the source region are positioned on the one sideand the other side of the control gates and the stack gate structuresrespectively.

In this present invention, the steps of forming the floating gateinclude forming a first conducting layer on the substrate; forming amaterial layer on the first conducting layer, wherein the material layerfills the gap between each of the stack gate structures; removing aportion of the material layer until the top surface of the materiallayer is between the top surface of said cap layer and the top surfaceof the select gate; removing a portion of the first conducting layer byusing the material layer as a mask; removing the material layer; andremoving the portion of the first conducting layer on the deviceinsulating structure to form the floating gate.

In this present invention, the step of forming the control gate stepincludes forming a second conducting layer on the substrate; andremoving a portion of the second conducting layer, until the top surfaceof the cap layer is exposed, to form the control gate.

In the present invention, the floating gate includes a recess. Thisincreases the area between the control gate and the floating gate toraise the gate coupling rate of flash memory cells and to reduce theworking voltage, thereby enhancing flash memory cells' operation speedand efficiency.

Moreover, this present invention fills the gap between the stack gatestructures with a conducting layer to form the control gate. Hence theprocess of the present invention is more simplified compared to theconventional process because no photolithography process is involved.

Furthermore, the present invention uses the hot carrier effect toprogram each flash memory cell as a unit, and uses Fowler-Nordhemtunneling to erase the entire flash memory cell array. Hence, the higherefficiency for electron injection can reduce the current required foroperating the flash memory cell and increase the operation speed.Furthermore, it also reduces the energy consumption of the entire array.

The present invention also provides a method for fabricating a flashmemory cell array. A substrate having a device insulating structure isprovided. Next, a plurality of stack gate structures are formed on thesubstrate, wherein the stack gate structure including a select gatedielectric layer, a select gate, and a cap layer, the select gatedielectric layer formed between the substrate and the select gate, andwherein the cap layer is formed on the select gate. Next, a tunneldielectric layer is formed on the substrate. Next, a spacer is formedalong the sidewall of the select gate. Next, a floating gate is formedbetween the stack gate structures. An inter-gate dielectric layer isformed on the floating gate. A control gate is formed to fill at leastone gap between the stack gate structures. A portion of stack gatestructures excluding a predetermined area of the flash memory cell arrayare removed. A drain region and a source region are formed in thesubstrate, wherein the drain region and the source region are formed onthe one side and the other side of the control gates and the stack gatestructures respectively.

In this present invention, the step of forming the floating gate furthercomprises forming a first conducting layer on the substrate; removing aportion of the first conducting layer until the top surface of the firstconducting layer is between the top surface of the cap layer and the topsurface of the select gate; and removing the portion of the firstconducting layer on the device insulating structure to form the floatinggate.

In this present invention, the step of forming the control gate furthercomprises forming a second conducting layer on the substrate; andremoving a portion of the second conducting layer, until the top surfaceof the cap layer is exposed, to form the control gate.

Moreover, this present invention fills the gap between the stack gatestructures with a conducting layer to form the control gate. Hence theprocess of the present invention is substantially simplified compared tothe conventional process because no photolithography is involved.

The above is a brief description of some deficiencies in the prior artand advantages of the present invention. Other features, advantages andembodiments of the invention will be apparent to those skilled in theart from the following description, accompanying drawings and appendedclaims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1A is a top view of a NAND type flash memory cell array of thepresent invention.

FIG. 1B is a cross section of a NAND type flash memory cell array takenalong the line A–A′ of FIG. 1A.

FIG. 1C is a cross section of a flash memory cell structure of thepresent invention.

FIGS. 2A–2F show a progressive process flowchart of a NAND type flashmemory cell array according to a preferred embodiment of the presentinvention.

FIG. 3 shows a circuit layout of a NAND type flash memory cell array ofthe present invention.

DESCRIPTION OF PREFERRED EMBODIMENTS

Reference will now be made in detail to the present preferredembodiments of the invention, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numbers areused in the drawings and the description to refer to the same or likeparts.

FIG. 1A shows a top view of a NAND type flash memory cell array of thepresent invention. FIG. 1B show the cross section (along A–A′ of FIG.1A) of a NAND type flash memory cell array of the present invention.

Referring to FIGS. 1A and 1B, the flash memory cell structure of thepresent invention comprise a substrate 100; a device insulatingstructure 102, an active region 104; a plurality of stack gatestructures 106 a–106 d, wherein each of the stack gate structureincludes a select gate dielectric layer 108, a select gate 110 and agate cap layer 112); a spacer 114, a tunneling dielectric layer 116, aplurality of floating gates 118 a–118 d, a plurality of control gates120 a–120 d, a plurality of inter-gate dielectric layers 122, a drainregion 124, and a source region 126.

In a preferred embodiment of the present invention, substrate 100 is aP-type substrate, and there is a deep N well 128 in substrate 100.Device insulating structure 102 is set in substrate 100 to define theactive region 104.

A plurality of stack gate structures 106 a–106 d is set on the substrate100 and perpendicular to the active region 104. In a preferredembodiment of the present invention, the thickness of stack gatestructures 106 a–106 d is about 2000–3500 Å. The material of the selectgate dielectric layer 108 is comprised of, for example, silicon dioxidewith a thickness of about 160–170 Å. The material of the select gate 110comprises, for example, doped polysilicon with a thickness of about600–1000 Å. The material of the gate cap layer 112 comprises, forexample, silicon dioxide with a thickness of about 1000–1500 Å. Thespacer 114 is set along the sidewall of the select gate 110. In apreferred embodiment of the present invention, the material of spacer114 comprises, for example, silicon dioxide.

A plurality of control gates 120 a–120 d are set on the substrate 100and on the one side of the stack gate structures 106 a–106 drespectively, and are orthogonal to the active region 104. Control gates120 a–120 d are connected to stack gate structures 106 a–106 drespectively, i.e., the stack gate structures juxtapose alternativelywith control gates. In a preferred embodiment of the present invention,the material of the control gates 120 a–120 d comprises, for example,doped polysilicon.

The floating gates 118 a–118 d are respectively set above the substrate100 where the control gates 120 a˜120 d cross the active region 104.Namely, floating gates 118 a–118 d are set between the control gates 120a–120 d and the active region 104 of the substrate 100. For example,each of the floating gates 118 a–118 d has a recess opening 119, and theupper surfaces of the floating gates 118 a˜118 d at the the stack gatestructures 106 a–106 d side could be formed between the upper surface ofthe select gate 110 and the upper surface of the cap layer 112, forexample.

The tunneling dielectric layer 116 is set between the floating gates 118a–118 d and the substrate 100. The inter-gate dielectric layer 122 isset between the control gates 120 a–120 d and the floating gates 118a–118 d. In a preferred embodiment of the present invention, thematerial of the tunneling dielectric layer 116 comprises, for example,silicon dioxide with a thickness of about 60–90 Å. The material of theinter-gate dielectric layer 122 comprises, for example, silicon,dioxide/silicon nitrite/silicon dioxide with a thickness of about70/70/60 Å. The material of the inter-gate dielectric layer 122comprises, for example, silicon dioxide/silicon nitrite.

In the active region 104, the flash memory cell array 130 comprises aplurality of stack gate structures 106 a–106 d, a spacer 114, a tunneldielectric layer 116, a plurality of floating gate 118 a–118 d, aplurality of control gates 102 a–120 d, and an inter-gate dielectriclayer 122. A drain region 124 in substrate 100 is set on the one side ofthe stack gate structure 106 a of the flash memory cell array 130. Asource region 126 in substrate 100 is set on the one side of the controlgate 120 d of the flash memory cell array 130. That is, the flash memorycell array 130 comprises a plurality of stacked gate structuresincluding a plurality control gates 102 a–120 d and a plurality offloating gates 118 a–118 d, and a plurality of stack gate structures 106a–106 d, wherein each of stack gate structures 106 a–106 d and each ofthe stack structures juxtapose alternatively. The drain region 124 andthe source region 126 are set on each side of the flash memory cellarray 130.

In the flash memory cell array 130, the stack structures (which includecontrol gate 120 a–120 d and floating gates 118 a–118 d) and stack gatestructures 106 a–106 d in the active region 104 constitute the flashmemory cell structures 132 a–132 d respectively. Because there is no gapbetween the flash memory cell structures 132 a–132 d, this design allowsfurther increase in the integration density of the flash memory cellarray 130.

Furthermore, in a preferred embodiment of the present invention, each offloating gates 118 a–118 d includes a recess 119. This recess 119increases the contact surface area between floating gates 118 a–118 dand control gates 120 a–120 d, which raises the gate coupling rate offlash memory cells and reduce the working voltage, thereby enhancingflash memory cells' operation speed and efficiency.

The above embodiments illustrate four flash memory cell structures as anexample to describe the merits of the invention. One skilled in the artmay apply any number of flash memory cell structures as needed.

FIG. 1C shows the cross section of a single flash memory cell structureof the present invention. This single flash memory cell structure 132includes a stack gate structures 106, a spacer 114, a tunnelingdielectric layer 116, a floating gates 118, a control gate 120, aninter-gate dielectric layer 122, a drain region 124 set on the one sideof stack gate structures 106, and a source region 126 set on the oneside of control gate 120. In a preferred embodiment of the presentinvention, floating gate 118 includes a recess 119. This recess 119increases the contact surface area between floating gate 118 and controlgate 120, which raises the gate coupling rate of flash memory cells andreduce the working voltage, thereby enhancing flash memory cellstructure's operation speed and efficiency.

The following description will illustrate the method of fabricating aflash memory cell array.

Referring to FIG. 2A, A substrate 200 is provided. The substrate 200 is,for example, a P-type substrate. A device insulating structure (notshown in the figures) and a deep N well 202 are formed in substrate 200.Then a dielectric layer 204, a conducting layer 206 and a cap layer 208are formed in substrate 200 in sequence. Preferably, the material of thedielectric layer 204 comprises, for example, silicon dioxide. Forexample, the dielectric layer 204 may be formed by thermal oxidation.Preferably, the material of the conducting layer 206 comprises dopedpolysilicon and can be formed by depositing a layer of undopedpolysilicon by using a chemical vapor deposition (CVD) process andfollowed by an ion implantation. The material of the cap layer 208 iscomprised of, for example, a silicon dioxide and can be formed by usinga chemical vapor deposition (CVD) process using tetra ethyl orthosilicate (TEOS) and ozone.

Referring to FIG. 2B, the cap layer 208, the conducting layer 206, andthe dielectric layer 204 are patterned to form a gate cap layer 208 a, agate conducting layer 206 a, and a gate dielectric layer 204 a,constituting the stacked gate structure 210. The gate conducting layer206 a and the gate dielectric layer 204 a serve as the select layer andthe select gate dielectric layer of the flash memory cell respectively.

A tunneling dielectric layer 212 is formed on the substrate 200. Next, aspacer 214 is formed on the sidewall of the gate conducting layer 206 a.Preferably, the tunneling dielectric layer 212 and the spacer 214 areformed by performing thermal oxidation.

Referring to FIG. 2C, another conducting layer 216 is formed on thesubstrate 200 such that the conducting layer 216 does not completelyfill or partially fill the gap between the stacked gate structures 210.Preferably, the material of conducting layer 216 comprises dopedpolysilicon and can be formed by depositing an undoped polysilicon layerusing a chemical vapor deposition process and then performing an ionimplantation.

A material layer 218 is formed over the conducting layer 216 tocompletely fill the gap between the stack gate structure 210, such thata top surface of the material layer 218 is laterally positioned betweena top portion of the gate cap layer 208 a and a top portion of the gateconducting layer 206 a. Preferably, the material of the material layer218 is comprised of a photoresist layer or an anti-reflecting coatinglayer and can be formed by performing a spin-coating process and thenetching back.

Referring to FIG. 2D, a portion of the conducting layer 216 is removedby using the material layer 218 as a mask, so that a top surface of theremaining conducting layer 216 is laterally positioned between a topportion of the gate conducting layer 206 a and a top portion of the gatecap layer 208 a. After removing the material layer 218, aphotolithography etching process is performed to remove a portion ofconducting layer 216 positioned above the device insulating structure,in order to form a patterned conducting layer 216 a between the stackedgate structures 210. The patterned conducting layer 216 a forms thefloating gate of the flash memory cell. The patterned conducting layer216 a includes a recess 219 so as to increase the contact surface areabetween itself and the control gate that is subsequently formed.Alternatively, the patterned conducting layer 216 a can be formed byperforming an etching back to remove a portion of conducting layer 216so that a top surface of the conducting layer 216 is laterallypositioned between a top surface of the gate conducting layer 206 a anda top surface of the gate cap layer 208 a. A portion of the conductinglayer 216 positioned above the device insulating structure is removed toform the patterned conducting layer 216 a.

Referring to FIG. 2E, an inter-gate dielectric layer 220 is formed overthe patterned conducting layer 216 a. Preferably, the material of theinter-gate dielectric layer 220 comprises silicon dioxide/siliconnitride/silicon dioxide, and can be formed by performing a thermaloxidation to form a silicon dioxide layer and then performing a CVD toform a silicon nitride layer and a silicon dioxide layer. Then anotherconducting layer 222 is formed over the substrate 200 to completely fillthe gap between the stack gate structures 210. Preferably, theconducting layer 222 is formed by forming a conducting material layerover substrate 200 and then removing a portion of conducting materiallayer until a top surface of the gate cap layer 208 a is exposed. Thematerial of the conducting layer 222 comprises doped polysilicon and canbe formed by forming an undoped polysilicon layer using a chemical vapordeposition and then performing an ion implantation.

Referring to FIG. 2F, a patterned photoresist layer (not shown) isformed over the substrate 200 to cover a predetermined area for formingthe flash memory cell array 224. Then the exposed stacked gatestructures or conducting layers are removed by using the patternedphotoresist layer as a mask. Then the source region 226 and the drainregion 228 are formed in the substrate 200 located at two sides of theflash memory cell array 224 by ion implantation. The drain region 226 ispositioned on one side of the flash memory cell array 224 with theconducting layer 222 (control gate). The source region 228 is positionedon the other side of the flash memory cell array 224 with the stack gatestructure 210 (select gate). The rest of the fabrication process of theflash memory cell array 224 is well known to those skilled in the artand therefore will not be described hereinafter.

In a preferred embodiment of the present invention, the floating gate(patterned conducting layer 216 a) includes a recess. This recessincreases the contact surface area between the floating gate (patternedconducting layer 216 a) and the control gate (conducting layer 222),which raises the gate coupling rate of flash memory cells and reduce theworking voltage, thereby enhancing flash memory cell structure'soperation speed and efficiency.

Moreover, the gap between the stack gate structures 210 is filled with aconducting layer to form the control gate (conducting layer 222). Hencethe fabrication process of the present invention is more simplifiedcompared to the conventional process because no photolithography processis required.

The above embodiments of the present invention illustrate the method offabricating four flash memory cell structures as an example however thepresent invention is not restricted to fabrication of four memory cellstructures, any number of flash memory cell structures may be fabricatedas required using the fabrication process of the present invention.

FIG. 3 shows a simplified circuit of a NAND type flash memory cell arrayof the present invention. In FIG. 3, an embodiment of a four flashmemory cell array is used to demonstrate its operation.

Referring to FIG. 3, this flash memory cell array includes four flashmemory cells Qn1–Qn4 serial connected, select gate lines SG1–SG4connected to the select gates of Qn1–Qn4 respectively, and control gateline CG1–CG4 connected to the control gates of Qn1–Qn4 respectively.

Before programming the array, a 4.5V, a 7V, a 11V, and a 0V are appliedto the source region, SG1–SG4, CG1–CG4, and the drain regionrespectively, to turn on the channels of Qn1–Qn4. During programming thearray, using Qn2 as an example, a 4.5V, a 1.5V, a 7V, a 9V, a 11V, and a0V are applied to the source region, the selected select gate line SG2,the non-selected select gate lines (SG1, SG3, and SG4), the selectedcontrol gate line CG2, the non-selected control gate lines (CG1, CG3,and CG4), and the substrate respectively, to cause source-side injectionin order to inject electrons into the selected flash memory cell Qn2 andprogram it.

During reading the data from the array, a 0V, a 4.5V, a 1.5V, and a 1.5Vare applied to the source region, SG1–SG4, CG1–CG4, and the drain region(the bit line) respectively. The value of the cell (“0” of “1”) dependson whether the floating gate is negatively charged or positivelycharged. If the floating gate is negatively charged, the flash memorycell's channel is off and the current is small. On the other hand, ifthe floating gate is positively charged, the flash memory cell's channelis on and the current can pass through the channel.

During erasing the data in the array, a 0V is applied to source region,SG1–SG4, and CG1–CG4 and a 11V is applied to the substrate, therebycausing Fowler-Nordhem tunneling to push electrons from the floatinggates into the substrate to erase the flash memory cell array.

The present invention uses the hot carrier effect to program each flashmemory cell as a unit, and uses Fowler-Nordhem tunneling to erase theentire flash memory cell array. Hence, the higher efficiency forelectron injection can reduce the current required for operating theflash memory cell and increase the operation speed. Furthermore, it alsoreduces the energy consumption of the entire array.

The above description provides a full and complete description of thepreferred embodiments of the present invention. Various modifications,alternate construction, and equivalent may be made by those skilled inthe art without changing the scope or spirit of the invention.Accordingly, the above description and illustrations should not beconstrued as limiting the scope of the invention which is defined by thefollowing claims.

1. A method for fabricating a flash memory cell array, comprising:providing a substrate having a device insulating structure; forming aplurality of stack gate structures on said substrate, and said stackgate structure including a select gate dielectric layer, a select gate,and a gate cap layer, wherein said select gate dielectric layer beingformed between said substrate and said select gate, said gate cap layerbeing formed on said select gate; forming a tunneling dielectric layeron said substrate; forming a spacer along a sidewall of said selectgate; forming a floating gate between each of said stack gatestructures, wherein said floating gate includes a recess and connectedto said stack gate structure, and an upper sidewall of the floating gateis defined as between a top surface of said gate cap layer and a topsurface of said select gate; forming an inter-gate dielectric layer onsaid floating gate; forming a control gate to fill at least one gapbetween each of said stack gate structures; removing a portion of saidstack gate structures excluding a predetermined area of said flashmemory cell array; and forming a drain region and a source region insaid substrate, said drain region and said source region being on theone side and the other side out of said control gates and said stackgate structures respectively.
 2. The method for fabricating a flashmemory cell array of claim 1, wherein the step of forming said floatinggate further comprises: forming a first conducting layer on saidsubstrate; forming a material layer on said first conducting layer, andsaid material layer filling at least one gap between each of said stackgate structures; removing a portion of said material layer until a topsurface of said material layer is between a top surface of said caplayer and a top surface of said select gate; removing a first portion ofsaid first conducting layer by using said material layer as a mask;removing the material layer; and removing a second portion of said firstconducting layer on said device insulating structure to form saidfloating gate.
 3. The method for fabricating a flash memory cell arrayof claim 2, wherein said material layer includes a photoresist layer. 4.The method for fabricating a flash memory cell array of claim 2, whereinsaid material layer includes an anti-reflecting coating layer.
 5. Themethod for, fabricating a flash memory cell array of claim 2, whereinsaid material layer step is formed by performing a spin coating process.6. The method for fabricating a flash memory cell array of claim 2.wherein the portion of said material layer is removed by performing anetching back process.
 7. The method for fabricating a flash memory cellarray of claim 1, wherein the step of forming said control gatecomprises: forming a second conducting layer on said substrate; andremoving a portion of said second conducting layer, until a top surfaceof said gate cap layer is exposed, to form said control gate.
 8. Themethod for fabricating a flash memory cell array of claim 7, wherein theportion of said second conducting layer is removed by performing anetching back process or a chemical mechanical polishing process.
 9. Amethod for fabricating a flash memory cell array, comprising: providinga substrate having a device insulating structure; forming a plurality ofstack gate structures on said substrate, and each of said stack gatestructure including a select gate dielectric layer, a select gate, and agate cap layer, wherein said select gate dielectric layer is formedbetween said substrate and said select gate, said gate cap layer isformed on said select gate; forming a tunneling dielectric layer on saidsubstrate; forming a spacer along a sidewall of said select gate;forming a floating gate between each of said stack gate structures;forming an inter-gate dielectric layer on said floating gate; forming acontrol gate in at least one gap between each of said stack gatestructures; removing a portion of said stack gate structures excluding apredetermined area of said flash memory cell array; and forming a drainregion and a source region in said substrate, said drain region and saidsource region being on the one side and the other side of said controlgates and said stack gate structures respectively, wherein the step offorming said floating gate comprises; forming a first conducting layeron said substrate; removing a first portion of said first conductinglayer until a top surface of said first conducting layer is between atop surface of said gate cap layer and a top surface of said selectgate; and removing a second portion of said first conducting layer onsaid device insulating structure to form said floating gate.
 10. Amethod for fabricating a flash memory cell array, of claim 9: whereinthe step of removing the portion of said first conducting layercomprises performing an etching back process.
 11. A method forfabricating a flash memory cell array, comprising: providing a substratehaving a device insulating structure; forming a plurality of stack gatestructures on said substrate, and each of said stack gate structureincluding a select gate dielectric layer, a select gate, and a gate caplayer, wherein said select gate dielectric layer is formed between saidsubstrate and said select gate, said gate cap layer is formed on saidselect gate; forming a tunneling dielectric layer on said substrate;forming a spacer alone a sidewall of said select gate; forming afloating gate between each of said stack gate structures; forming aninter-gate dielectric layer on said floating gate; forming a controlgate in at least one gap between each of said stack gate structures;removing a portion of said stack gate structures excluding apredetermined area of said flash memory cell array; and forming a drainregion and a source region in said substrate, said drain region and saidsource region being on the one side and the other side of said controlgates and said stack gate structures respectively, wherein the step offorming said control gate comprises; forming a second conducting layeron said substrate; and removing a portion of said second conductinglayer, until a top surface of said gate cap layer is exposed, to formsaid control gate.
 12. The method for fabricating a flash memory cellarray of claim 11, wherein the step of removing the portion of saidsecond conducting layer comprises performing an etching back process ora chemical mechanical polishing process.